Test assembly and method of manufacturing the same

ABSTRACT

A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, a space transformer, an intermediary supporting element, an adhesive element, a plurality of electrical connection elements and a plurality of test probes. The space transformer is disposed on the main circuit board and has a first surface and a second surface opposite to the first surface. The first surface faces the main circuit board. The intermediary supporting element is disposed between the main circuit board and the first surface. The adhesive element is disposed between the intermediary supporting element and the first surface. The space transformer is attached to the intermediary supporting element through the adhesive element. The electrical connection elements are disposed between the main circuit board and the first surface. Each of the electrical connection elements passes through the intermediary supporting element and the adhesive element such that the space transformer is electrically connected to the main circuit board through the electrical connection elements. The test probes are disposed on the second surface and electrically connected to the space transformer.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based on and claims the benefit of priority fromTaiwan Patent Application 104106182 filed on Feb. 26, 2015, which isincorporated herein by reference and assigned to the assignee herein.

FIELD OF THE INVENTION

The present invention relates to a test assembly and a method ofmanufacturing the test assembly, and particularly relates to a testassembly for testing a semiconductor device and a method ofmanufacturing the test assembly.

DESCRIPTION OF THE PRIOR ART

FIG. 1 is a schematic view of a conventional test assembly. Referring toFIG. 1, a conventional test assembly 100 is suitable for testing asemiconductor device 10 such as a wafer. The test assembly 100 comprisesa main circuit board 110, a space transformer 120, a plurality of solderballs 130, a plurality of test probes 140 and an underfill 150. Thespace transformer 120 is disposed on the main circuit board 110. Thesolder balls 130 are disposed between the main circuit board 110 and thespace transformer 120. The space transformer 120 is electricallyconnected to the main circuit board 110 through the solder balls 130.The test probes 140 are disposed on a side of the space transformer 120opposite to the solder balls 130 and electrically connected to the spacetransformer 120.

The underfill 150 is filled between the main circuit board 110 and thespace transformer 120 to enclose the solder balls 130. The underfill 150reduces the thermal stress causing fatigue at junctions of the solderballs 130 so as to enhance the reliability of the points at which themain circuit board 110 and the space transformer 120 are soldered to thesolder balls 130.

During a test conducted on the semiconductor device 10 with the testassembly 100, the semiconductor device 10 placed on a stage (not shown)thrusts upward to hit the test probes 140 under specific pressure. Atthis time, the underfill 150 and the solder balls 130 are alsoinfluenced by the aforesaid pressure. However, having been thrust andhit frequently for a long period of time, the underfill 150 cannot fullyprotect the solder balls 130 such that the good electrical connectionbetween the main circuit board 110 and the space transformer 120 failsto remain. As a result, part of the solder balls 130 in the conventionaltest assembly 100 are likely to have cracks and even fracture after longor frequent use such that the electrical connection between the maincircuit board 110 and the space transformer 120 is reversely affected.

Moreover, in the event of the aforesaid deterioration of electricalconnection, a user who wants to dismount and reset the solder balls 130will be hindered due to adhesion caused by the presence of the underfill150.

SUMMARY OF THE INVENTION

The present invention provides a test assembly, wherein during a testprocess, defects of electrical connection elements between a maincircuit board and a space transformer due to pressure exerted thereonare not easily produced.

The present invention provides a test assembly, wherein electricalconnection elements between a main circuit board and a space transformercan be easily dismounted and reset because of the absence of theaforesaid adhesion of the underfill.

The present invention provides a test assembly suitable for testing asemiconductor device. The test assembly comprises a main circuit board,a space transformer, an intermediary supporting element, an adhesiveelement, a plurality of electrical connection elements and a pluralityof test probes. The space transformer is disposed on the main circuitboard and has a first surface and a second surface opposite to the firstsurface. The first surface faces the main circuit board. Theintermediary supporting element is disposed between the main circuitboard and the first surface. The adhesive element is disposed betweenthe intermediary supporting element and the first surface. The spacetransformer is attached to the intermediary supporting element throughthe adhesive element. The electrical connection elements are disposedbetween the main circuit board and the first surface. Each of theelectrical connection elements penetrates the intermediary supportingelement and the adhesive element such that the space transformer iselectrically connected to the main circuit board through the electricalconnection elements. The test probes are disposed at the second surfaceand electrically connected to the space transformer.

According to an embodiment of the present invention, adhesion strengthunder which the adhesive element is attached to the space transformer islarger than pressure exerted by the electrical connection elements uponthe space transformer.

According to an embodiment of the present invention, adhesion strengthunder which the adhesive element is attached to the intermediarysupporting element is larger than pressure exerted by the electricalconnection elements upon the space transformer.

According to an embodiment of the present invention, each of theelectrical connection elements is a pogo pin.

According to an embodiment of the present invention, the test assemblyfurther comprises a holding element disposed on the main circuit board.The holding element presses against the intermediary supporting elementto maintain the positional relation between the intermediary supportingelement and the main circuit board.

According to an embodiment of the present invention, the test assemblyfurther comprises a holding element disposed on the main circuit board.The holding element presses against the space transformer to maintainthe positional relation between the space transformer, the intermediarysupporting element and the main circuit board.

According to an embodiment of the present invention, the adhesiveelement is a hot-melt adhesive.

According to an embodiment of the present invention, an assembledmechanism composed of the intermediary supporting element and the spacetransformer attached to the intermediary supporting element isdetachably disposed on the main circuit board. The electrical connectionelements are detachably disposed in the intermediary supporting element.

The present invention also provides a method of manufacturing a testassembly comprising the following steps. First, an adhesive element isdisposed on a first surface of a space transformer. Afterwards, aplurality of through holes are formed in the adhesive element.Afterwards, an intermediary supporting element is attached to the firstsurface of the space transformer through the adhesive element.Afterwards, each of a plurality of electrical connection elements isdisposed in one of a plurality of through holes of the intermediarysupporting element and one of the through holes of the adhesive elementsuch that each of the electrical connection elements penetrates theintermediary supporting element and the adhesive element. Afterwards,the space transformer, the intermediary supporting element and theelectrical connection elements which have been assembled are disposed ona main circuit board such that the first surface faces the main circuitboard and the space transformer is electrically connected to the maincircuit board through the electrical connection elements. Thereafter,the test probes are disposed on a second surface of the spacetransformer opposite of the first surface such that the test probes areelectrically connected to the space transformer.

The present invention further provides another method of manufacturing atest assembly comprising the following steps. First, an adhesive elementis disposed on an intermediary supporting element. Afterwards, aplurality of through holes are formed in the adhesive element.Afterwards, a first surface of a space transformer is attached to theintermediary supporting element through the adhesive element.Afterwards, each of a plurality of electrical connection elements isdisposed in one of a plurality of through holes of the intermediarysupporting element and one of the through holes of the adhesive elementsuch that each of the electrical connection elements penetrates theintermediary supporting element and the adhesive element. Afterwards,the space transformer, the intermediary supporting element and theelectrical connection elements which have been assembled are disposed ona main circuit board such that the first surface faces the main circuitboard and the space transformer is electrically connected to the maincircuit board through the electrical connection elements. Thereafter,the test probes are disposed on a second surface of the spacetransformer opposite of the first surface such that the test probes areelectrically connected to the space transformer.

According to an embodiment of the present invention, the step ofattaching the intermediary supporting element to the first surface ofthe space transformer through the adhesive element comprises heating upthe adhesive element to perform hot-melt adhesion between theintermediary supporting element and the first surface of the spacetransformer.

According to an embodiment of the present invention, the step of formingthe through holes in the adhesive element is carried out with a laserperforation process.

During a test conducted on the semiconductor device with the testassembly of each of the embodiments of the present invention, theassembled mechanism composed of the intermediary supporting element andthe space transformer attached to the intermediary supporting elementcan bear part of the pressure caused by the semiconductor devicethrusting upward and hitting the test probes. Therefore, compared withthe prior art, after being used longer or frequently, the electricalconnection elements of the test assembly of each of the embodiments ofthe present invention are less likely to get damaged such that the goodelectrical connection between the main circuit board and the spacetransformer can be still maintained.

The following description, the appended claims, and the embodiments ofthe present invention further illustrate the features and advantages ofthe present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a conventional test assembly.

FIG. 2 is a schematic view of a test assembly according to a firstembodiment of the present invention.

FIG. 3A through FIG. 3E are schematic views of the method ofmanufacturing the test assembly of FIG. 2.

FIG. 4 is a schematic view of a test assembly according to a secondembodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS First Embodiment

FIG. 2 is a schematic view of a test assembly according to a firstembodiment of the present invention. Referring to FIG. 2, a testassembly 200 of the first embodiment is suitable for testing asemiconductor device 20 such as a wafer. The test assembly 200 comprisesa main circuit board 210, a space transformer 220, an intermediarysupporting element 230, an adhesive element 240, a plurality ofelectrical connection elements 250 and a plurality of test probes 260.The space transformer 220 is disposed on the main circuit board 210 andhas a first surface 222 and a second surface 224 opposite to the firstsurface 222. The first surface 222 of the space transformer 220 facesthe main circuit board 210.

The intermediary supporting element 230 is disposed between the maincircuit board 210 and the first surface 222 of the space transformer 220and has a plurality of through holes 232. The adhesive element 240 suchas a hot-melt adhesive is disposed between the intermediary supportingelement 230 and the first surface 222 of the space transformer 220 andhas a plurality of through holes 242. The space transformer 220 isattached to the intermediary supporting element 230 through the adhesiveelement 240.

The electrical connection elements 250 such as a plurality of pogo pinsare disposed between the main circuit board 210 and the first surface222 of the space transformer 220. Each of the electrical connectionelements 250 is disposed in one of the through holes 232 of theintermediary supporting element 230 and one of the through holes 242 ofthe adhesive element 240 such that each of the electrical connectionelements 250 penetrates the intermediary supporting element 230 and theadhesive element 240. In this embodiment, the intermediary supportingelement 230 can be a pogo housing, and the electrical connectionelements 250 such as the pogo pins are detachably disposed in theintermediary supporting element 230.

The space transformer 220 is electrically connected to the main circuitboard 210 through the electrical connection elements 250. Specifically,one of electrical pads (not shown) disposed on the first surface 222 ofthe space transformer 220 is electrically connected to one of electricalpads (not shown) of the main circuit board 210 through one of theelectrical connection elements 250. The space transformer 220 hastherein a wiring and thus can be regarded as another circuit board.

In this embodiment, the adhesion strength under which the adhesiveelement 240 is attached to the space transformer 220 is larger than thepressure exerted by the electrical connection elements 250, such as pogopins, upon the space transformer 220. In this embodiment, the adhesionstrength under which the adhesive element 240 is attached to theintermediary supporting element 230 is also larger than the pressureexerted by the electrical connection elements 250, such as pogo pins,upon the space transformer 220.

In the first embodiment, the test assembly 200 further comprises a probehead 270. The probe head 270 and the test probes 260 are disposed on thesecond surface 224 of the space transformer 220. The test probes 260penetrate the probe head 270 to be electrically connected to the spacetransformer 220. Specifically, the test probes 260 are electricallyconnected to electrical pads (not shown) disposed on the second surface224 of the space transformer 220, respectively. In this embodiment, eachof the test probes 260 is, for example, a vertical-type probeexemplified by a pogo probe. However, in another embodiment, each of thetest probes 260 is a buckling beam probe (not shown). In addition to thevertical-type probe, each of the test probes 260 can be a probe of anytype but is not shown in any figures. In yet another embodiment, theprobe head 270 is dispensed with.

In this embodiment, the test assembly 200 further comprises a mainstiffener 280, a plurality of fasteners 290 and a holding element H1.Each of the fasteners 290 is, for example, a bolt. The main stiffener280 is fixedly disposed on the main circuit board 210 through thefasteners 290. The main stiffener 280 reinforces the structural strengthof the main circuit board 210. The main stiffener 280 and the spacetransformer 220 are disposed on two opposite sides of the main circuitboard 210, respectively.

The holding element H1 is disposed on the main circuit board 210 by thefasteners 290. The holding element H1 presses against the intermediarysupporting element 230 to maintain the positional relation between theintermediary supporting element 230 and the main circuit board 210. Inthis embodiment, an assembled mechanism composed of the intermediarysupporting element 230 and the space transformer 220 attached to theintermediary supporting element 230 is detachable. That is, theassembled mechanism is detachably disposed on the main circuit board210.

A method of manufacturing the test assembly 200 according to thisembodiment is described below. FIG. 3A through FIG. 3E are schematicviews of the method of manufacturing the test assembly of FIG. 2. First,referring to FIG. 3A, the adhesive element 240 is disposed on the firstsurface 222 of the space transformer 220. Afterwards, referring to FIG.3B, the through holes 242 are formed in the adhesive element 240. Inthis embodiment, the step of forming the through holes 242 in theadhesive element 240 is carried out with a laser perforation process.Afterwards, referring to FIG. 3C, the intermediary supporting element230 is attached to the first surface 222 of the space transformer 220through the adhesive element 240. In this embodiment, the step ofattaching the intermediary supporting element 230 to the first surface222 of the space transformer 220 through the adhesive element 240comprises heating up the adhesive element 240 to perform hot-meltadhesion between the intermediary supporting element 230 and the firstsurface 222 of the space transformer 220. However, in anotherembodiment, the aforesaid three steps can be replaced by three steps asfollows: placing the adhesive element on the intermediary supportingelement; forming the through holes in the adhesive element; andattaching the first surface of the space transformer to the intermediarysupporting element through the adhesive element. However, theaforementioned three replacing steps are not shown in any figures.

Afterwards, referring to FIG. 3D, each of the electrical connectionelements 250 is disposed in one of the through holes 232 of theintermediary supporting element 230 and one of the through holes 242 ofthe adhesive element 240 such that each of the electrical connectionelements 250 penetrates the intermediary supporting element 230 and theadhesive element 240. Afterwards, referring to FIG. 3E, the spacetransformer 220, the intermediary supporting element 230 and theelectrical connection elements 250 which have been assembled aredisposed on the main circuit board 210 such that the first surface 222of the space transformer 220 faces the main circuit board 210 and thespace transformer 220 is electrically connected to the main circuitboard 210 through the electrical connection elements 250. Thereafter,referring to FIG. 3E again, the test probes 260 are disposed on thesecond surface 224 of the space transformer 220 opposite to the firstsurface 222 such that the test probes 260 are electrically connected tothe space transformer 220.

Referring to FIG. 2 again, during a test conducted on the semiconductordevice 20 with the test assembly 200, the semiconductor device 20 placedon a stage (not shown) thrusts upward to hit the test probes 260 underspecific pressure. At this time, the intermediary supporting element 230and the electrical connection elements 250 are also influenced by theaforesaid pressure. However, the assembled mechanism composed of theintermediary supporting element 230 and the space transformer 220attached to the intermediary supporting element 230 has sufficientcompressive strength to bear part of the aforesaid pressure. Therefore,compared with the prior art, after being used longer or frequently, theelectrical connection elements 250 of the test assembly 200 of thisembodiment are less likely to get damaged such that the good electricalconnection between the main circuit board 210 and the space transformer220 can be still maintained.

Nonetheless, after being used much longer or frequently, the electricalconnection elements 250 get damaged inevitably and thus the electricalconnection between the main circuit board 210 and the space transformer220 is reversely affected. However, since the assembled mechanismcomposed of the intermediary supporting element 230 and the spacetransformer 220 attached to the intermediary supporting element 230 isdetachable, upon separation of the main circuit board 210 and theassembled mechanism, the damaged electrical connection elements 250 canbe detached and then replaced with new electrical connection elements250. Therefore, compared with the prior art, the electrical connectionelements 250 of the test assembly 200 of this embodiment of the presentinvention can be easily dismounted and reset.

Second Embodiment

FIG. 4 is a schematic view of a test assembly according to a secondembodiment of the present invention. Referring to FIG. 2 and FIG. 4, thedifference between a test assembly 300 of the second embodiment and thetest assembly 200 of the first embodiment lies in that a holding elementH1′ of the test assembly 300 of the second embodiment presses against aspace transformer 320 to maintain the positional relation between thespace transformer 320, an intermediary supporting element 330 and a maincircuit board 310.

Each of the aforementioned embodiments of the present invention has oneof the following advantages or another advantage. During a testconducted on the semiconductor device with the test assembly of each ofthe embodiments of the present invention, the assembled mechanismcomposed of the intermediary supporting element and the spacetransformer attached to the intermediary supporting element can bearpart of the pressure caused by the semiconductor device thrusting upwardand hitting the test probes. Therefore, compared with the prior art,after being used longer or frequently, the electrical connectionelements of the test assembly of each of the embodiments of the presentinvention are less likely to get damaged such that the good electricalconnection between the main circuit board and the space transformer canbe still maintained.

Nonetheless, after being used much longer or frequently, the electricalconnection elements of each of the aforementioned embodiments of thepresent invention get damaged inevitably. However, since the assembledmechanism composed of the intermediary supporting element and the spacetransformer attached to the intermediary supporting element isdetachable, upon separation of the main circuit board and the assembledmechanism, the damaged electrical connection elements can be detachedand then replaced with new electrical connection elements. Therefore,compared with the prior art, the electrical connection elements of thetest assembly of each of the embodiments of the present invention can beeasily dismounted and reset.

The foregoing detailed description of the embodiments is used to furtherclearly describe the features and spirit of the present invention. Theforegoing description for each embodiment is not intended to limit thescope of the present invention. All kinds of modifications made to theforegoing embodiments and equivalent arrangements should fall within theprotected scope of the present invention. Hence, the scope of thepresent invention should be explained most widely according to theclaims described thereafter in connection with the detailed description,and should cover all the possibly equivalent variations and equivalentarrangements.

What is claimed is:
 1. A test assembly, suitable for testing asemiconductor device, comprising: a main circuit board; a spacetransformer, disposed on the main circuit board and having a firstsurface and a second surface opposite to the first surface, wherein thefirst surface faces the main circuit board; an intermediary supportingelement, disposed between the main circuit board and the first surface;an adhesive element, disposed between the intermediary supportingelement and the first surface, wherein the space transformer is attachedto the intermediary supporting element through the adhesive element; aplurality of electrical connection elements, disposed between the maincircuit board and the first surface, wherein each of the electricalconnection elements penetrates the intermediary supporting element andthe adhesive element such that the space transformer is electricallyconnected to the main circuit board through the electrical connectionelements; and a plurality of test probes, disposed at the second surfaceand electrically connected to the space transformer, wherein adhesionstrength under which the adhesive element is attached to theintermediary supporting element is larger than pressure exerted by theelectrical connection elements upon the space transformer.
 2. The testassembly of claim 1, wherein each of the electrical connection elementsis a pogo pin.
 3. The test assembly of claim 1, further comprising aholding element disposed on the main circuit board, wherein the holdingelement presses against the intermediary supporting element to maintainthe positional relation between the intermediary supporting element andthe main circuit board.
 4. The test assembly of claim 1, furthercomprising a holding element disposed on the main circuit board, whereinthe holding element presses against the space transformer to maintainthe positional relation between the space transformer, the intermediarysupporting element and the main circuit board.
 5. The test assembly ofclaim 1, wherein the adhesive element is a hot-melt adhesive.
 6. Thetest assembly of claim 1, wherein an assembled mechanism composed of theintermediary supporting element and the space transformer attached tothe intermediary supporting element is detachably disposed on the maincircuit board, and the electrical connection elements are detachablydisposed in the intermediary supporting element.
 7. The test assembly ofclaim 1, wherein adhesion strength under which the adhesive element isattached to the space transformer is larger than pressure exerted by theelectrical connection elements upon the space transformer.
 8. A testassembly, suitable for testing a semiconductor device, comprising: amain circuit board; a space transformer, disposed on the main circuitboard and having a first surface and a second surface opposite to thefirst surface, wherein the first surface faces the main circuit board;an intermediary supporting element, disposed between the main circuitboard and the first surface; an adhesive element, disposed between theintermediary supporting element and the first surface, wherein the spacetransformer is attached to the intermediary supporting element throughthe adhesive element; a plurality of electrical connection elements,disposed between the main circuit board and the first surface, whereineach of the electrical connection elements penetrates the intermediarysupporting element and the adhesive element such that the spacetransformer is electrically connected to the main circuit board throughthe electrical connection elements; and a plurality of test probes,disposed at the second surface and electrically connected to the spacetransformer, wherein adhesion strength under which the adhesive elementis attached to the space transformer is larger than pressure exerted bythe electrical connection elements upon the space transformer.
 9. Thetest assembly of claim 8, wherein each of the electrical connectionelements is a pogo pin.
 10. The test assembly of claim 8, furthercomprising a holding element disposed on the main circuit board, whereinthe holding element presses against the intermediary supporting elementto maintain the positional relation between the intermediary supportingelement and the main circuit board.
 11. The test assembly of claim 8,further comprising a holding element disposed on the main circuit board,wherein the holding element presses against the space transformer tomaintain the positional relation between the space transformer, theintermediary supporting element and the main circuit board.
 12. The testassembly of claim 8, wherein the adhesive element is a hot-meltadhesive.
 13. The test assembly of claim 8, wherein an assembledmechanism composed of the intermediary supporting element and the spacetransformer attached to the intermediary supporting element isdetachably disposed on the main circuit board, and the electricalconnection elements are detachably disposed in the intermediarysupporting element.
 14. A method of manufacturing a test assembly,comprising: disposing an adhesive element on a first surface of a spacetransformer; forming a plurality of through holes in the adhesiveelement after disposing the adhesive element on the first surface of thespace transformer; attaching an intermediary supporting element to thefirst surface of the space transformer through the adhesive element;disposing each of a plurality of electrical connection elements in oneof a plurality of through holes of the intermediary supporting elementand one of the through holes of the adhesive element such that each ofthe electrical connection elements penetrates the intermediarysupporting element and the adhesive element; disposing the spacetransformer, the intermediary supporting element and the electricalconnection elements which have been assembled on a main circuit boardsuch that the first surface faces the main circuit board and the spacetransformer is electrically connected to the main circuit board throughthe electrical connection elements; and disposing the test probes on asecond surface of the space transformer opposite of the first surfacesuch that the test probes are electrically connected to the spacetransformer.
 15. The method of claim 14, wherein the step of attachingthe intermediary supporting element to the first surface of the spacetransformer through the adhesive element comprises heating up theadhesive element to perform hot-melt adhesion between the intermediarysupporting element and the first surface of the space transformer. 16.The method of claim 14, wherein the step of forming the through holes inthe adhesive element is carried out with a laser perforation process.17. A method of manufacturing a test assembly, comprising: disposing anadhesive element on an intermediary supporting element; forming aplurality of through holes in the adhesive element after disposing theadhesive element on the intermediary supporting element; attaching afirst surface of a space transformer to the intermediary supportingelement through the adhesive element; disposing each of a plurality ofelectrical connection elements in one of a plurality of through holes ofthe intermediary supporting element and one of the through holes of theadhesive element such that each of the electrical connection elementspenetrates the intermediary supporting element and the adhesive element;disposing the space transformer, the intermediary supporting element andthe electrical connection elements which have been assembled on a maincircuit board such that the first surface faces the main circuit boardand the space transformer is electrically connected to the main circuitboard through the electrical connection elements; disposing the testprobes on a second surface of the space transformer opposite of thefirst surface such that the test probes are electrically connected tothe space transformer.
 18. The method of claim 17, wherein the step ofattaching the intermediary supporting element to the first surface ofthe space transformer through the adhesive element comprises heating upthe adhesive element to perform hot-melt adhesion between theintermediary supporting element and the first surface of the spacetransformer.
 19. The method of claim 17, wherein the step of forming thethrough holes in the adhesive element is carried out with a laserperforation process.